Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 62 items
Minimizing development man-hours, industrial network embedded module.
Anybus CompactCom enables hardware development in one go, making multi-network deployment easy. It is an embedded module that can be selected from three implementation forms to match hardware and specifications.
Intel Pentium/Celeron N4200 series and Atom series
Intel Pentium/Celeron N4200 series and Atom series ● Intel Pentium/Celeron N4200 series and Atom SoC ● Qseven 2.1 specification ● Up to 16GB LPDDR4 onboard, up to 64GB eMMC onboard ● Supports HEVC/H.265, H.264 MPEG2 HW DECODE ● GbE, 3 PCIe x 1, 2 x USB3.0, 5 x USB2.0 ● Compatible with iManager WISE-PaaS/RMM and embedded software API
AMD Ryzen Embedded V Series Gaming Platform
- AMD Ryzen Embedded V1000 processor - High-performance Radeon VEGA series graphics - Supports four 4K monitors - Comprehensive gaming features - Maximum 25W with fan cooler, 54W passive cooling system - 12V DC single input or ATX power supply
NVIDIA RTX 3000 Embedded equipped Type B+
NVIDIA RTX 3000 Embedded equipped Type B+
![SKY-MXM-RTX3000_02-_Square20220324141350[1].jpg](https://image.mono.ipros.com/public/product/image_sub/68c/2001559380/IPROS172411761215226908.jpg?w=280&h=280){kind=small}
Equipped with Intel Atom/Pentium/Celeron processors (Apollo Lake)
The SMARC module "PSMC-M101" is equipped with Intel Atom/Pentium/Celeron processors, and the system memory supports onboard DDR4 2133/2400. ● For more details, please download the catalog.
PCI-Express Gen3 with 7 lanes and support for USB4! Abundant and flexible interface configuration.
The "PCOM-B658VGL" is a COM-Express Type 6 module equipped with Intel's 12th/13th generation Core processors. It supports H series/P series/U series CPUs, offering a wide range of specifications from TDP 15W to 45W, allowing for selection based on application and usage environment. Additionally, it supports PCI-Express Gen4 and DDR5 memory, making it suitable for AI edge computing and mission-critical applications. 【Features】 ■ Equipped with Intel 12th/13th generation Core processors ■ Up to 6 P-cores, 8 E-cores, and 96 graphics execution units ■ Supports DDR5 memory, with the capability to implement 2 modules on the board ■ Optionally supports an industrial temperature range of -40℃ to 85℃ ■ Optionally supports onboard SSD *For more details, please download the PDF or feel free to contact us.
PCI-Express Gen3, two USB4 (optional), and USB3.2 Gen2 interfaces are also provided!
The PCOM-B659 is a COM-Express module compatible with the 13th generation Intel Core series processors. Depending on the CPU used, it offers a TDP ranging from 15W to 28W, and industrial-grade temperature range products can be selected according to your needs. It is also suitable for mission-critical applications and AI edge computing. 【Features】 ■ Equipped with 13th generation Intel Core series processors ■ Up to 6 P (Performance) cores + 8 E (Efficient) cores, 96 EUs ■ Supports up to 96GB of DDR5-5200 memory ■ Abundant PCI-Express lanes ■ Optional support for temperature range from -40℃ to 85℃ ■ Option to include onboard PCIe NVMe SSD *For more details, please download the PDF or feel free to contact us.
Supports 4K screen output! Excellent in both power efficiency and cost performance.
The "PCOM-BA03GL" is a COM-Express Type 10 Mini module equipped with the Intel Atom x7000 series processor (Amston Lake). This architecture offers low power consumption ranging from 6W to 12W while supporting screen output at up to 4K resolution via LVDS, HDMI, eDP, and DP, operating at 3.6GHz during turbo boost, and includes PCI-Express 3.0 lanes and USB 3.2 Gen 2, all while accommodating an industrial extended operating temperature range of -40°C to 85°C. It can be utilized in various fields, including industrial automation, medical, and transportation. 【Features】 ■ Equipped with Intel Atom x7000E series processor ■ Onboard LPDDR5 SDRAM expandable up to 16GB ■ Onboard eMMC expandable up to 64GB ■ Low power consumption (6W to 12W) ■ Supports 4K screen output ■ Operating temperature range of -40°C to 85°C *For more details, please download the PDF or feel free to contact us.
Equipped with a high-power yet low-power consumption processor! A product that can be utilized for various applications.
The "WSC-M31" is a SMARC 2.1 module equipped with an Intel Amston Lake generation processor. It supports LPDDR5 memory and features a variety of interfaces. Additionally, it is compatible with PCI-Express Gen3 and supports a total of six USB ports. Please feel free to contact us if you have any inquiries. 【Features】 ■ Supports LPDDR5 memory ■ Equipped with a variety of interfaces ■ PCI-Express Gen3 compatible ■ Supports a total of six USB ports *For more details, please download the PDF or feel free to contact us.
Intelligent XMC module capable of realizing EtherCAT master communication.
AdXMC1573 is an XMC module with EtherCAT master communication capabilities. The CPU uses the ARM Cortex-A9 found in the Xilinx Zynq, functioning as an intelligent type XMC module. The EtherCAT master protocol stack is equipped with acontis technologies' "EC Master" and is Class A compliant. It also supports cable redundancy and hot connect as part of its Feature Pack. This module is controlled by the host CPU. Data transfer is conducted via shared memory built into this module. It functions as an intelligent slave, enabling EtherCAT master communication without burdening the host CPU.
Introducing fanless compact systems with China Compulsory Certification (CCC certification)!
The "ATE3845.WS7E/4G/32G/EC7" is a compact fanless system that has obtained CCC certification and features a screw-lock AC adapter. It offers extensive expandability with four COM ports and five USB ports. It can be wall-mounted, VESA-mounted, or DIN rail-mounted. This product will be available for long-term supply until 2025. 【Features】 - Extensive expandability with four COM ports and five USB ports - Equipped with a screw-lock AC adapter - Wall mountable, VESA mountable, and DIN rail mountable - Product with China Compulsory Certification (CCC certification) *For more details, please refer to the PDF document or feel free to contact us.
NXP i.MX6 Cortex-A9 System on Module
The Digi ConnectCore 6N is an ultra-compact and highly integrated system on module (SOM) based on the NXP i.MX6 Cortex-A9 processor family. With a processor speed of up to 1.2GHz and fully interchangeable single/dual/quad-core types, the ConnectCore 6N offers scalable performance and a truly future-proof platform solution that includes certified 802.11a/b/g/n/ac and Bluetooth Low Energy, as well as Bluetooth 5.0 wireless connectivity. The low-profile surface mount design maximizes integration flexibility and significantly reduces design risk with a cost-effective and reliable form factor that enables optimal management even in the most challenging quad-core system configurations.
The VIA SOM-5000 module accelerates the development of advanced edge AI systems and devices.
The VIA SOM-5000 module, equipped with the new MediaTek Genio 700 octa-core processor, provides a flexible and feature-rich platform that reduces time to market for power-efficient smart home, retail, and industrial IoT systems and devices.
NXP i.MX93 series processor equipped OSM R1.1 Size L module
The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.
NXP i.MX95 series processor equipped OSM R1.2 Size L module
The ADLINK OSM-IMX95 is a compact module compliant with the latest OSM revision 1.2, based on the powerful NXP i.MX95 processor (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) and integrates an eIQ Neutron neural processing unit (NPU) that operates with an ISP and up to 2 TOPS. Its dimensions are 45mm x 45mm. It offers high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and features for fast data processing and security.
Supports short delivery times, with the ROM-ized OS (WES7P) pre-installed.
This is a compact fanless system equipped with a Dual Core CPU (Atom D2550 1.86GHz). It comes pre-installed with an industrial-grade OS (WES7P), allowing for immediate use. Additionally, we can accommodate short delivery times and ensure stable supply.
High-performance embedded GPU module featuring NVIDIA Blackwell architecture and equipped with 24GB GDDR7.
Accelerating the next evolution of AI with the Aetina CoreEdge MX5000B-XA — equipped with NVIDIA RTX PRO 5000 Blackwell: The MX5000B-XA MXM 3.1 Type B GPU module integrates the NVIDIA RTX PRO 5000 Blackwell GPU and features the latest NVIDIA CUDA and ray tracing technologies. It delivers exceptional AI performance, large memory capacity, and high throughput, making it ideal for high-performance edge AI applications. Aetina ensures a 5-year product lifespan for this solution, guaranteeing long-term reliability and support. Unlocking next-generation AI performance for physical AI and humanoid robots: Designed to accelerate demanding edge workloads and advanced graphics processing, it targets multimodal AI, agent AI, simulation, 3D graphics, multi-scenario rendering, advanced generative AI, and complex real-time computational tasks.
A CAD embedded module that easily outputs process data from AutoForm and can be imported into the CATIA environment.
"AutoForm-QuickLink for CATIA" is a CAD embedded module that provides a seamless data flow between AutoForm and CATIA. In the process design department, it is possible to enhance work efficiency through more efficient collaboration with internal and external departments. The output data includes concept shape data such as surfaces, curves, points, project information, material information, and process information. 【Features】 ■ Data exchange between AutoForm and CATIA ■ Consistency, transparency, and usability of data ■ Streamlining of CAD design processes ■ Prevention of downstream process issues 【Main Functions】 ■ Input and output only the necessary shape and process data between AutoForm and CATIA ■ Easily modify shapes, part positions, tipping, and cam directions ■ Consistent naming and terminology ■ Complete transfer of process structures *For more details, please refer to the PDF materials or feel free to contact us.
A CAD embedded module that can enhance work efficiency through more efficient collaboration with internal and external departments.
"AutoForm-QuickLink for NX" is a CAD embedded module that provides a seamless data flow between AutoForm and NX. It allows for easy output of process data from AutoForm and integration into the NX environment. The output data includes concept shape data such as surfaces, curves, points, project information, material information, and process information. Additionally, simulation results can be exported. 【Features】 ■ Data exchange between AutoForm and NX ■ Consistency, transparency, and usability of data ■ Streamlining of CAD design processes ■ Prevention of downstream process issues 【Main Functions】 ■ Input and output only the necessary shape and process data between AutoForm and NX ■ Easy modification of shapes, part positions, tipping, and cam directions ■ Consistent naming and terminology ■ Complete transfer of process structure *For more details, please refer to the external link page or feel free to contact us.
How about revitalizing Okayama using IoT? We have examples of IoT applications and case studies available.
This document introduces the Okayama IoT Consortium "Everyone's IoT." It includes examples of IoT implementation and the hurdles of adopting IoT, starting with the Fourth Industrial Revolution. "Everyone's IoT" aims to lower the barriers to IoT adoption by bringing together different industries as one team to share challenges, materialize ideas, and leverage their areas of expertise. Our company is waiting for inquiries regarding the consortium and consultations about IoT implementation. [Contents (excerpt)] ■ Company Profile ■ Business Overview ■ Fourth Industrial Revolution ■ Examples of IoT Utilization ■ IoT Implementation Cases *For more details, please refer to the PDF document or feel free to contact us.
AI solutions, live demos too!
We will be exhibiting at "Japan IT Week Spring," which will be held from April 8 (Wednesday) to April 10 (Friday), 2026, for the first time in seven years. Our subsidiary Aetina will also exhibit at the same booth. Event Dates: April 8 (Wednesday) to April 10 (Friday), 2026 10:00 AM to 5:00 PM Venue: Tokyo Big Sight West Hall 3, Booth Number W20-52 [Exhibits] ◆ Flash Storage (PCIe Gen4, Gen5 / iSLC Solutions) ◆ DRAM Modules (Ultra WT, DDR5 6400, CAMM2, CXL, MRDIMM) ◆ Embedded Peripherals (CAN Bus, LAN Modules) ◆ Camera Modules (USB, MIPI, GSML) ◆ Industrial PCs (SBC, uATX, miniITX, BOX PC) ◆ AI Solutions (APEX Series, Qualcomm Solutions)
AI edge computing is possible! Introducing the SOM board equipped with the MediaTek i500 processor.
The "SY-I50-SOM" is an AIoT platform that incorporates the MediaTek i500 (MT8385) for AI/AR/VR applications. It supports advanced full HD multimedia encoding/decoding capabilities, as well as advanced AI features such as deep learning, neural network acceleration, and computer vision applications. Additionally, we offer an evaluation kit called "SY-I50-EVK (tentative)," which serves as a dedicated evaluation environment and development platform for the SY-I50-SOM. 【Features】 ■ SOM board equipped with MediaTek i500 processor ■ Capable of AI edge computing *For more details, please refer to the PDF materials or feel free to contact us.
70mm x 40mm! Modular and compact Qseven form factor.
We would like to introduce our product, the 'iW-RainboW-G34M/G37M-Q7'. This product features a 64-bit ARMv8 architecture and a product lifespan program of over 10 years. Additionally, it is equipped with IEEE 802.11a/b/g/n/ac Wi-Fi and Bluetooth 5.0. 【Features】 ■ i.MX 8M Mini ■ i.MX 8M Nano Q/QL/D/DL/S/SL CPU ■ 64-bit ARMv8 architecture ■ Product lifespan program of over 10 years ■ IEEE 802.11a/b/g/n/ac Wi-Fi *For more details, please refer to the PDF document or feel free to contact us.
Supports Cortex-A55 cores! Over 10 years of product lifespan program.
We would like to introduce the "iW-RainboW-G53M," which we handle. This product is an OSM-SE LGA module based on the Renesas G2UL, A3UL, or FIVE. It is equipped with a Renesas G2UL or A3UL SoC featuring a 64-bit ARMv8.2 A architecture. 【Features】 ■ Renesas G2UL or A3UL SoC ■ Renesas FIVE SoC ■ 1GB DDR4 memory (expandable based on chip availability) ■ Supports Cortex-A55 cores (G2UL and A3UL) ■ Supports Cortex-M33 core for RTOS (G2UL) *For more details, please refer to the PDF document or feel free to contact us.
Equipped with a high-performance quad-core Cortex-A53 CPU, dual Cortex-R5 CPUs, and Arm Mali-400MP2 GPU!
We would like to introduce the 'ZU15/ZU9/ZU6- Zynq UltraScale+ MPSoC System on Module iW-RainboW-G65M' that we handle. It offers 16 x GTH transceivers (up to 16.3Gbps) and various interfaces (such as Gigabit Ethernet, USB 2.0 OTG), and supports an operating temperature range of -20°C to +85°C. As a result, it is an ideal module for vertical markets such as industrial, medical, automotive, and aerospace. 【Features (partial)】 ■ Compatible with AU25P/20P/15P/10P ■ Up to 308K Logic cells & 141K LUTs ■ 16 channels of GTY transceivers up to 16.375Gbps ■ 72 LVDS Pairs and 66 SE PL IOs *For more details, please download the PDF or feel free to contact us.
![[ODM/EMS Case Study] VE Proposal Example for Gear Units](https://image.mono.ipros.com/public/product/image/955/2000694755/IPROS83061193510545997088.png?w=280&h=280)
We have achieved a reduction of approximately 70% in component costs! We will propose specifications utilizing our expertise in circuit design and mechanical design!
Our company is engaged in the ODM and EMS business for electronic devices such as automotive equipment, consumer electronics, industrial equipment, and medical devices. We are actively responding to "VE proposals," including cost reduction of components in the development of electronic devices for automotive use. We can support everything from development, design, manufacturing, quality assurance, to evaluation, and we also cater to OEMs that specialize in technology provision. Please feel free to consult with us. 【VE Proposal Example: Rotational Control Using DC Motors】 Proposal Details: As an alternative to stepping motors used for rotational control such as angle adjustment and storage, we propose a combination of "DC motors," "Hall ICs," and "magnets." Results: Successfully achieved a reduction of approximately 70% in component costs! *For more details, please refer to the materials available for download in PDF format. Feel free to contact us as well. We are also currently holding an online exhibition where you can view our business offerings in more detail.
Ultra-compact fanless embedded system with dimensions of 115mm × 48.7mm × 111mm!
The "EB100-KU" is a fanless embedded system that achieves high computing power and 4K graphics performance with 6th/7th generation Intel(R) Core(TM) processors. It also features high-speed I/O and expansion ports, providing an efficient and reliable solution for large-scale data processing. 【Features】 ■ Palm-sized embedded system ■ Smart and powerful ■ Advanced interconnectivity ■ Enjoyable 4K visuals ■ Highly adaptable to unstable conditions *For more details, please download the PDF (English version) or feel free to contact us.
Fanless embedded system equipped with 1GB/2GB DDR3L memory!
The EC900-FS6 is a fanless embedded system equipped with a reliable 2.5-inch board designed in-house. It supports 8GB/16GB eMMC storage and is suitable for various applications such as edge AI, signage, and IoT. 【Features】 ■ Built-in in-house designed board (FS053) ■ High reliability in product quality and stability ■ Small board and compact chassis with low power consumption ■ DIN rail mountable ■ Wide voltage input ■ Wide operating temperature range *For more details, please download the PDF or feel free to contact us.
Robust GPU computing system
The 【MZ1-10ADP】 is a robust GPU computing embedded system equipped with Intel Alder Lake-S / Core-i i/Xeon TDP.
